JPH0625910Y2 - 基板実装コネクタの整列取付用治具 - Google Patents
基板実装コネクタの整列取付用治具Info
- Publication number
- JPH0625910Y2 JPH0625910Y2 JP4404390U JP4404390U JPH0625910Y2 JP H0625910 Y2 JPH0625910 Y2 JP H0625910Y2 JP 4404390 U JP4404390 U JP 4404390U JP 4404390 U JP4404390 U JP 4404390U JP H0625910 Y2 JPH0625910 Y2 JP H0625910Y2
- Authority
- JP
- Japan
- Prior art keywords
- jig
- board
- mounting
- land
- aligning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011295 pitch Substances 0.000 claims description 9
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims description 7
- 238000003780 insertion Methods 0.000 description 19
- 230000037431 insertion Effects 0.000 description 19
- 239000000758 substrate Substances 0.000 description 8
- 239000006071 cream Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 229910000906 Bronze Inorganic materials 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 239000010974 bronze Substances 0.000 description 3
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 210000005036 nerve Anatomy 0.000 description 2
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4404390U JPH0625910Y2 (ja) | 1990-04-26 | 1990-04-26 | 基板実装コネクタの整列取付用治具 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4404390U JPH0625910Y2 (ja) | 1990-04-26 | 1990-04-26 | 基板実装コネクタの整列取付用治具 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH045091U JPH045091U (en]) | 1992-01-17 |
| JPH0625910Y2 true JPH0625910Y2 (ja) | 1994-07-06 |
Family
ID=31556990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4404390U Expired - Lifetime JPH0625910Y2 (ja) | 1990-04-26 | 1990-04-26 | 基板実装コネクタの整列取付用治具 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0625910Y2 (en]) |
-
1990
- 1990-04-26 JP JP4404390U patent/JPH0625910Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH045091U (en]) | 1992-01-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |